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MOS管损坏(huai)是(shi)什么原(yuan)因 开(kai)关耗损详(xiang)细(xi)原(yuan)因

信息来源:本站 日(ri)期(qi):2017-07-06 

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mos在控制器电路中的工作状态:开经过程(由截止到导通的过渡过程)、导通状态、关断过程(由导通到截止的过渡过程)、截止状态。Mos主要损耗也对应这几个状态,开关损耗(开经过程和关断过程),导通损耗,截止损耗(漏电流惹起的,这个忽略不计),还有雪崩能量损耗。只需把这些损耗控制在mos承受规格之内,mos即会正常工作,超出承受范围,即发作损坏。

而开关损耗常常大于导通状态损耗(不同mos这个差距可能很大)。
Mos损坏主要缘由:  过流----------持续大电流或瞬间超大电流惹起的结温过高而烧毁;
过压----------源漏过压击穿、源栅极过压击穿;静电----------静电击穿。CMOS电路都怕静电; Mos开关(guan)原(yuan)理(扼要)。Mos是电压驱动型器件,只需栅极和源级间给一个恰当电压,源级和漏级间通路就构成。这个电流通路的电阻被成为mos内阻,就是导通电阻。这个内阻大小基本决议了mos芯片能承受的最大导通电流(当然和其它要素有关,最有关的是热阻)。内阻越小承受电流越大(由于发热小)。

Mos问题远没这么简单,省事在它的栅极和源级间,源级和漏级间,栅极和漏级间MOS管(guan)三个极内部都有等(deng)效电容(rong)(rong)。所以给(ji)栅极电压(ya)(ya)的(de)(de)过程(cheng)就是给(ji)电容(rong)(rong)充电的(de)(de)过程(cheng)(电容(rong)(rong)电压(ya)(ya)不能(neng)突变(bian)),所以mos源级(ji)和漏级(ji)间由截止到导通的(de)(de)开经过程(cheng)受栅极电容(rong)(rong)的(de)(de)充电过程(cheng)限(xian)制。 

但是(shi)(shi),这(zhei)(zhei)三个(ge)(ge)(ge)等效电(dian)(dian)(dian)容是(shi)(shi)构(gou)成串并联组(zu)合(he)关系,它们相(xiang)互影响(xiang),并不(bu)(bu)是(shi)(shi)独(du)立的(de)(de),假设独(du)立的(de)(de)就(jiu)很简单了。其中(zhong)一个(ge)(ge)(ge)关键电(dian)(dian)(dian)容就(jiu)是(shi)(shi)栅(zha)(zha)极(ji)(ji)和(he)漏级(ji)间(jian)的(de)(de)电(dian)(dian)(dian)容Cgd,这(zhei)(zhei)个(ge)(ge)(ge)电(dian)(dian)(dian)容业界称为米(mi)勒(le)(le)电(dian)(dian)(dian)容。这(zhei)(zhei)个(ge)(ge)(ge)电(dian)(dian)(dian)容不(bu)(bu)是(shi)(shi)恒定的(de)(de),随栅(zha)(zha)极(ji)(ji)和(he)漏级(ji)间(jian)电(dian)(dian)(dian)压变化而疾速变化。这(zhei)(zhei)个(ge)(ge)(ge)米(mi)勒(le)(le)电(dian)(dian)(dian)容是(shi)(shi)栅(zha)(zha)极(ji)(ji)和(he)源级(ji)电(dian)(dian)(dian)容充(chong)电(dian)(dian)(dian)的(de)(de)绊脚(jiao)石,由(you)于栅(zha)(zha)极(ji)(ji)给栅(zha)(zha)-源电(dian)(dian)(dian)容Cgs充(chong)电(dian)(dian)(dian)抵(di)达(da)一个(ge)(ge)(ge)平(ping)(ping)台后,栅(zha)(zha)极(ji)(ji)的(de)(de)充(chong)电(dian)(dian)(dian)电(dian)(dian)(dian)流(liu)必需给米(mi)勒(le)(le)电(dian)(dian)(dian)容Cgd充(chong)电(dian)(dian)(dian),这(zhei)(zhei)时(shi)栅(zha)(zha)极(ji)(ji)和(he)源级(ji)间(jian)电(dian)(dian)(dian)压不(bu)(bu)再升(sheng)高,抵(di)达(da)一个(ge)(ge)(ge)平(ping)(ping)台,这(zhei)(zhei)个(ge)(ge)(ge)是(shi)(shi)米(mi)勒(le)(le)平(ping)(ping)台(米(mi)勒(le)(le)平(ping)(ping)台就(jiu)是(shi)(shi)给Cgd充(chong)电(dian)(dian)(dian)的(de)(de)过程),米(mi)勒(le)(le)平(ping)(ping)台大(da)(da)家首(shou)先想到的(de)(de)省事(shi)就(jiu)是(shi)(shi)米(mi)勒(le)(le)振荡。(即(ji),栅(zha)(zha)极(ji)(ji)先给Cgs充(chong)电(dian)(dian)(dian),抵(di)达(da)一定平(ping)(ping)台后再给Cgd充(chong)电(dian)(dian)(dian))由(you)于这(zhei)(zhei)个(ge)(ge)(ge)时(shi)分源级(ji)和(he)漏级(ji)间(jian)电(dian)(dian)(dian)压疾速变化,内部电(dian)(dian)(dian)容相(xiang)应(ying)疾速充(chong)放电(dian)(dian)(dian),这(zhei)(zhei)些(xie)电(dian)(dian)(dian)流(liu)脉冲(chong)会(hui)招致(zhi)mos寄生(sheng)电(dian)(dian)(dian)感产生(sheng)很大(da)(da)感抗,这(zhei)(zhei)里面就(jiu)有(you)电(dian)(dian)(dian)容,电(dian)(dian)(dian)感,电(dian)(dian)(dian)阻组(zu)成震荡电(dian)(dian)(dian)路(能(neng)构(gou)成2个(ge)(ge)(ge)回路),并且电(dian)(dian)(dian)流(liu)脉冲(chong)越强频(pin)率(lv)越高震荡幅(fu)度越大(da)(da)。所(suo)以最(zui)关键的(de)(de)问题(ti)就(jiu)是(shi)(shi)这(zhei)(zhei)个(ge)(ge)(ge)米(mi)勒(le)(le)平(ping)(ping)台如(ru)何过渡。


Gs极加(jia)电(dian)(dian)容,减慢(man)mos管导(dao)通时(shi)间(jian)(jian),有(you)助于减小米(mi)(mi)勒(le)振(zhen)荡(dang)(dang)。防止mos管烧毁。过快的(de)(de)(de)充电(dian)(dian)会招致(zhi)猛烈的(de)(de)(de)米(mi)(mi)勒(le)震荡(dang)(dang),但过慢(man)的(de)(de)(de)充电(dian)(dian)虽减小了震荡(dang)(dang),但会延长(zhang)开(kai)关(guan)从(cong)而增(zeng)加(jia)开(kai)关(guan)损耗(hao)。Mos开(kai)经过程(cheng)源级和漏级间(jian)(jian)等(deng)效电(dian)(dian)阻(zu)相当于从(cong)无量大(da)(da)电(dian)(dian)阻(zu)到(dao)阻(zu)值(zhi)很小的(de)(de)(de)导(dao)通内阻(zu)(导(dao)通内阻(zu)普(pu)通低压mos只需(xu)几毫(hao)欧姆)的(de)(de)(de)一(yi)(yi)个转变(bian)过程(cheng)。比如一(yi)(yi)个mos最大(da)(da)电(dian)(dian)流100a,电(dian)(dian)池电(dian)(dian)压96v,在(zai)开(kai)经过程(cheng)中,有(you)那么一(yi)(yi)瞬间(jian)(jian)(刚(gang)进入米(mi)(mi)勒(le)平台时(shi))mos发(fa)热(re)(re)功(gong)率是P=V*I(此时(shi)电(dian)(dian)流已达最大(da)(da),负载尚未跑起来(lai),一(yi)(yi)切的(de)(de)(de)功(gong)率都降落在(zai)MOS管上),P=96*100=9600w!这时(shi)它发(fa)热(re)(re)功(gong)率最大(da)(da),然后发(fa)热(re)(re)功(gong)率疾(ji)速降低直到(dao)完好导(dao)通时(shi)功(gong)率变(bian)成100*100*0.003=30w(这里(li)假定这个mos导(dao)通内阻(zu)3毫(hao)欧姆)。开(kai)关(guan)过程(cheng)中这个发(fa)热(re)(re)功(gong)率变(bian)化是惊人的(de)(de)(de)。

假设开(kai)(kai)(kai)(kai)通时间慢(man)(man),意味着(zhe)发热(re)从(cong)9600w到30w过渡的慢(man)(man),mos结(jie)温(wen)会升(sheng)高的凶(xiong)猛。所以开(kai)(kai)(kai)(kai)关越(yue)慢(man)(man),结(jie)温(wen)越(yue)高,容(rong)易烧(shao)mos。为(wei)了(le)不烧(shao)mos,只(zhi)能(neng)(neng)降(jiang)低(di)mos限(xian)流或(huo)者降(jiang)低(di)电池(chi)电压,比如给(ji)它(ta)限(xian)制50a或(huo)电压降(jiang)低(di)一半成(cheng)48v,这样开(kai)(kai)(kai)(kai)关发热(re)损(sun)耗(hao)也降(jiang)低(di)了(le)一半。不烧(shao)管(guan)子了(le)。这也是(shi)高压控(kong)(kong)容(rong)易烧(shao)管(guan)子缘由(you),高压控(kong)(kong)制器和(he)(he)低(di)压的只(zhi)需(xu)(xu)开(kai)(kai)(kai)(kai)关损(sun)耗(hao)不一样(开(kai)(kai)(kai)(kai)关损(sun)耗(hao)和(he)(he)电池(chi)端电压基(ji)本成(cheng)正比,假定限(xian)流一样),导通损(sun)耗(hao)完(wan)好受mos内阻决议(yi),和(he)(he)电池(chi)电压没任何关系。其实整个mos开(kai)(kai)(kai)(kai)经(jing)过程非常(chang)(chang)复杂。里面变量太多。总之就(jiu)是(shi)开(kai)(kai)(kai)(kai)关慢(man)(man)不容(rong)易米勒(le)震(zhen)荡(dang),但(dan)开(kai)(kai)(kai)(kai)关损(sun)耗(hao)大,管(guan)子发热(re)大,开(kai)(kai)(kai)(kai)关速(su)度快理论上(shang)开(kai)(kai)(kai)(kai)关损(sun)耗(hao)低(di)(只(zhi)需(xu)(xu)能(neng)(neng)有效抑止(zhi)米勒(le)震(zhen)荡(dang)),但(dan)是(shi)常(chang)(chang)常(chang)(chang)米勒(le)震(zhen)荡(dang)很凶(xiong)猛(假设米勒(le)震(zhen)荡(dang)很严重,可能(neng)(neng)在米勒(le)平(ping)台就(jiu)烧(shao)管(guan)子了(le)),反而(er)开(kai)(kai)(kai)(kai)关损(sun)耗(hao)也大,并(bing)且上(shang)臂(bei)mos震(zhen)荡(dang)更有可能(neng)(neng)惹起下(xia)臂(bei)mos误(wu)导通,构(gou)成(cheng)上(shang)下(xia)臂(bei)短路。所以这个很考验设计(ji)师的驱(qu)动电路布(bu)线和(he)(he)主回路布(bu)线技艺(yi)。最终就(jiu)是(shi)找个平(ping)衡(heng)点(普通开(kai)(kai)(kai)(kai)经(jing)过程不超(chao)越(yue)1us)。


开通(tong)损(sun)耗(hao)这(zhei)(zhei)个(ge)最简单,只和导通(tong)电(dian)(dian)阻成正(zheng)比,想大电(dian)(dian)流(liu)(liu)低损(sun)耗(hao)找(zhao)内(nei)阻低的(de)。下面(mian)引见下对(dui)普(pu)通(tong)用户适用点(dian)的(de)。 Mos选择(ze)的(de)重要参数扼要说(shuo)明。以datasheet举(ju)例说(shuo)明。  栅极(ji)电(dian)(dian)荷(he)。Qgs, Qgd  Qgs:指的(de)是栅极(ji)从0v充电(dian)(dian)到对(dui)应(ying)电(dian)(dian)流(liu)(liu)米(mi)勒(le)平(ping)台(tai)时总(zong)充入电(dian)(dian)荷(he)(理论电(dian)(dian)流(liu)(liu)不(bu)同(tong),这(zhei)(zhei)个(ge)平(ping)台(tai)高度(du)不(bu)同(tong),电(dian)(dian)流(liu)(liu)越(yue)大,平(ping)台(tai)越(yue)高,这(zhei)(zhei)个(ge)值越(yue)大)。这(zhei)(zhei)个(ge)阶段(duan)是给(ji)Cgs充电(dian)(dian)(也相当于Ciss,输入电(dian)(dian)容)。  Qgd:指的(de)是整个(ge)米(mi)勒(le)平(ping)台(tai)的(de)总(zong)充电(dian)(dian)电(dian)(dian)荷(he)(在这(zhei)(zhei)称为米(mi)勒(le)电(dian)(dian)荷(he))。这(zhei)(zhei)个(ge)过(guo)程给(ji)Cgd(Crss,这(zhei)(zhei)个(ge)电(dian)(dian)容随着gd电(dian)(dian)压不(bu)同(tong)疾速变化)充电(dian)(dian)。

开(kai)关(guan)过(guo)冲中,mos主要(yao)发(fa)热(re)区间是(shi)(shi)(shi)粗红色(se)标(biao)注的阶段。从Vgs开(kai)端超(chao)越阈值(zhi)(zhi)电压(ya),到米(mi)勒(le)(le)平(ping)台(tai)(tai)终了是(shi)(shi)(shi)主要(yao)发(fa)热(re)区间。其(qi)中米(mi)勒(le)(le)平(ping)台(tai)(tai)终了后mos基(ji)本(ben)(ben)完好翻开(kai)这(zhei)时(shi)损(sun)(sun)耗(hao)(hao)(hao)(hao)是(shi)(shi)(shi)基(ji)本(ben)(ben)导(dao)通(tong)损(sun)(sun)耗(hao)(hao)(hao)(hao)(mos内(nei)阻越低(di)(di)(di)损(sun)(sun)耗(hao)(hao)(hao)(hao)越低(di)(di)(di))。阈值(zhi)(zhi)电压(ya)前,mos没(mei)有翻开(kai),几乎没(mei)损(sun)(sun)耗(hao)(hao)(hao)(hao)(只需漏电流惹起的一(yi)点(dian)损(sun)(sun)耗(hao)(hao)(hao)(hao))。其(qi)中又以(yi)红色(se)拐弯中央损(sun)(sun)耗(hao)(hao)(hao)(hao)最(zui)大(Qgs充电将近终了,快到米(mi)勒(le)(le)平(ping)台(tai)(tai)和(he)刚进入(ru)米(mi)勒(le)(le)平(ping)台(tai)(tai)这(zhei)个过(guo)程发(fa)热(re)功率最(zui)大(更粗线表示)。 所以(yi)一(yi)定充电电流下,红色(se)标(biao)注区间总(zong)电荷(he)小(xiao)的管子(zi)会很快渡过(guo),这(zhei)样发(fa)热(re)区间时(shi)间就(jiu)短(duan),总(zong)发(fa)热(re)量(liang)就(jiu)低(di)(di)(di)。所以(yi)理(li)论上选择Qgs和(he)Qgd小(xiao)的mos管能快速渡过(guo)开(kai)关(guan)区。导(dao)通(tong)内(nei)阻。Rds(on)。这(zhei)个耐压(ya)一(yi)定情况下是(shi)(shi)(shi)越低(di)(di)(di)越好。不过(guo)不同(tong)厂家标(biao)的内(nei)阻是(shi)(shi)(shi)有不同(tong)测试条(tiao)(tiao)件的。测试条(tiao)(tiao)件不同(tong),内(nei)阻丈量(liang)值(zhi)(zhi)会不一(yi)样。


同一管(guan)子,温(wen)度(du)越(yue)高(gao)内(nei)阻越(yue)大(这是(shi)硅半导(dao)体材料在mos制造(zao)工艺的(de)特性,改动不了,能(neng)稍改善)。所以大电(dian)(dian)流(liu)测(ce)(ce)试(shi)内(nei)阻会增大(大电(dian)(dian)流(liu)下结温(wen)会显著升(sheng)高(gao)),小(xiao)(xiao)电(dian)(dian)流(liu)或(huo)脉(mai)冲电(dian)(dian)流(liu)测(ce)(ce)试(shi),内(nei)阻降低(di)(由(you)于(yu)结温(wen)没有(you)大幅升(sheng)高(gao),没热积聚)。有(you)的(de)管(guan)子标称典型内(nei)阻和(he)你自己用小(xiao)(xiao)电(dian)(dian)流(liu)测(ce)(ce)试(shi)几(ji)乎一样(yang),而(er)有(you)的(de)管(guan)子自己小(xiao)(xiao)电(dian)(dian)流(liu)测(ce)(ce)试(shi)比标称典型内(nei)阻低(di)很多(由(you)于(yu)它的(de)测(ce)(ce)试(shi)标准是(shi)大电(dian)(dian)流(liu))


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