P沟道MOS管参数、型号及工作(zuo)原理大全-KIA MOS管
信息来(lai)源:本站 日期:2018-08-22
① 开启(qi)电压VGS(th) (或VT)
开启电(dian)压是(shi)MOS增(zeng)强型(xing)管的参数,栅源电(dian)压小于开启电(dian)压的绝对值,场效应管不(bu)能导通
② 夹断电压VGS(off) (或VP)
夹断电(dian)压是耗尽型FET的参数,当VGS=VGS(off) 时,漏极(ji)电(dian)流为(wei)零(ling)
③ 饱(bao)和漏(lou)极电流IDSS
耗尽型场效应(ying)三(san)极(ji)管,当VGS=0时所对应(ying)的漏(lou)极(ji)电(dian)流
④ 输入电(dian)阻RGS
场(chang)效应三极管的栅(zha)源输入电阻的典(dian)型(xing)(xing)值(zhi),对于(yu)结(jie)型(xing)(xing)场(chang)效应三极管,反偏(pian)时RGS约大于(yu)107Ω,对于(yu)绝(jue)缘栅(zha)场(chang)型(xing)(xing)效应三极管,RGS约是109~1015Ω
⑤ 低频(pin)跨(kua)导(dao)gm
低频跨(kua)导反映(ying)了栅压对漏(lou)极电流的控(kong)制作(zuo)(zuo)用(yong),这一点与电子管的控(kong)制作(zuo)(zuo)用(yong)十分(fen)相像。gm可以在(zai)转移(yi)特性曲线上求取,单位是mS(毫西门子)
⑥ 最大漏极功耗PDM
最大漏极功耗可由PDM= VDS ID决定,与双极型三极管(guan)的PCM相当
金属(shu)氧(yang)化物半导(dao)体(ti)(ti)(ti)场(chang)(chang)(chang)效(xiao)应(ying)(ying)(MOS)晶(jing)体(ti)(ti)(ti)管(guan)可分(fen)为(wei)N沟(gou)道(dao)(dao)(dao)与P沟(gou)道(dao)(dao)(dao)两(liang)大类, P沟(gou)道(dao)(dao)(dao)硅(gui)MOS场(chang)(chang)(chang)效(xiao)应(ying)(ying)晶(jing)体(ti)(ti)(ti)管(guan)在(zai)N型(xing)(xing)(xing)(xing)硅(gui)衬底(di)上有两(liang)个P+区(qu),分(fen)别(bie)叫做源(yuan)(yuan)极(ji)(ji)和漏(lou)极(ji)(ji),两(liang)极(ji)(ji)之间不通导(dao),柵极(ji)(ji)上加(jia)有足够的(de)正电压(源(yuan)(yuan)极(ji)(ji)接地)时,柵极(ji)(ji)下的(de)N型(xing)(xing)(xing)(xing)硅(gui)表面呈现P型(xing)(xing)(xing)(xing)反型(xing)(xing)(xing)(xing)层,成为(wei)衔接源(yuan)(yuan)极(ji)(ji)和漏(lou)极(ji)(ji)的(de)沟(gou)道(dao)(dao)(dao)。改动栅压可以改动沟(gou)道(dao)(dao)(dao)中的(de)电子密度,从而改动沟(gou)道(dao)(dao)(dao)的(de)电阻。这(zhei)种MOS场(chang)(chang)(chang)效(xiao)应(ying)(ying)晶(jing)体(ti)(ti)(ti)管(guan)称为(wei)P沟(gou)道(dao)(dao)(dao)增强(qiang)型(xing)(xing)(xing)(xing)场(chang)(chang)(chang)效(xiao)应(ying)(ying)晶(jing)体(ti)(ti)(ti)管(guan)。假设N型(xing)(xing)(xing)(xing)硅(gui)衬底(di)表面不加(jia)栅压就已(yi)存(cun)在(zai)P型(xing)(xing)(xing)(xing)反型(xing)(xing)(xing)(xing)层沟(gou)道(dao)(dao)(dao),加(jia)上恰(qia)当的(de)偏压,可使沟(gou)道(dao)(dao)(dao)的(de)电阻增大或减小。这(zhei)样的(de)MOS场(chang)(chang)(chang)效(xiao)应(ying)(ying)晶(jing)体(ti)(ti)(ti)管(guan)称为(wei)P沟(gou)道(dao)(dao)(dao)耗尽型(xing)(xing)(xing)(xing)场(chang)(chang)(chang)效(xiao)应(ying)(ying)晶(jing)体(ti)(ti)(ti)管(guan)。统称为(wei)PMOS晶(jing)体(ti)(ti)(ti)管(guan)。
P沟(gou)道(dao)MOS晶(jing)(jing)体(ti)(ti)管(guan)(guan)的(de)(de)空穴迁移率低,因而在MOS晶(jing)(jing)体(ti)(ti)管(guan)(guan)的(de)(de)几何(he)尺寸和工作电(dian)压绝对值相等(deng)(deng)的(de)(de)情(qing)况(kuang)下,PMOS晶(jing)(jing)体(ti)(ti)管(guan)(guan)的(de)(de)跨导(dao)小(xiao)于(yu)(yu)N沟(gou)道(dao)MOS晶(jing)(jing)体(ti)(ti)管(guan)(guan)。此外,P沟(gou)道(dao)MOS晶(jing)(jing)体(ti)(ti)管(guan)(guan)阈值电(dian)压的(de)(de)绝对值普通(tong)(tong)偏高(gao),恳求有较高(gao)的(de)(de)工作电(dian)压。它的(de)(de)供电(dian)电(dian)源的(de)(de)电(dian)压大(da)(da)小(xiao)和极(ji)(ji)性(xing),与双极(ji)(ji)型晶(jing)(jing)体(ti)(ti)管(guan)(guan)——晶(jing)(jing)体(ti)(ti)管(guan)(guan)逻辑(ji)电(dian)路(lu)(lu)不兼容。PMOS因逻辑(ji)摆幅大(da)(da),充电(dian)放(fang)电(dian)过程(cheng)长,加之器件跨导(dao)小(xiao),所以(yi)工作速度更(geng)低,在NMOS电(dian)路(lu)(lu)(见N沟(gou)道(dao)金属—氧化物—半导(dao)体(ti)(ti)集成(cheng)电(dian)路(lu)(lu))呈现之后(hou),多(duo)数已为(wei)NMOS电(dian)路(lu)(lu)所取代。只是,因PMOS电(dian)路(lu)(lu)工艺简单,价钱低价,有些(xie)中范围和小(xiao)范围数字控制电(dian)路(lu)(lu)仍采用PMOS电(dian)路(lu)(lu)技术。PMOS的(de)(de)特性(xing),Vgs小(xiao)于(yu)(yu)一定的(de)(de)值就(jiu)会导(dao)通(tong)(tong),适宜用于(yu)(yu)源极(ji)(ji)接VCC时的(de)(de)情(qing)况(kuang)(高(gao)端(duan)(duan)驱动(dong))。但是,固(gu)然PMOS可(ke)以(yi)很便当地用作高(gao)端(duan)(duan)驱动(dong),但由于(yu)(yu)导(dao)通(tong)(tong)电(dian)阻大(da)(da),价钱贵,交流种类少等(deng)(deng)缘由,在高(gao)端(duan)(duan)驱动(dong)中,通(tong)(tong)常还(hai)是运(yun)用NMOS。
正常(chang)工作时,P沟道(dao)增强(qiang)型MOS管(guan)的(de)衬(chen)底(di)必需(xu)与(yu)源极(ji)相连,而漏心极(ji)的(de)电(dian)压Vds应(ying)为(wei)(wei)负值,以保证两个P区与(yu)衬(chen)底(di)之间的(de)PN结均为(wei)(wei)反偏,同(tong)时为(wei)(wei)了在衬(chen)底(di)顶表面左近构成(cheng)导电(dian)沟道(dao),栅极(ji)对(dui)源极(ji)的(de)电(dian)压Vgs也应(ying)为(wei)(wei)负。
1.Vds≠O的(de)(de)情况导电沟(gou)道(dao)构成(cheng)以后,DS间(jian)加负(fu)向电压(ya)时(shi),那么在源极(ji)(ji)(ji)与漏极(ji)(ji)(ji)之间(jian)将有漏极(ji)(ji)(ji)电流Id流通(tong),而且Id随Vds而增加.Id沿(yan)沟(gou)道(dao)产(chan)生(sheng)的(de)(de)压(ya)降使沟(gou)道(dao)上(shang)各点(dian)与栅极(ji)(ji)(ji)间(jian)的(de)(de)电压(ya)不再相等,该(gai)电压(ya)削弱了栅极(ji)(ji)(ji)中(zhong)负(fu)电荷电场的(de)(de)作用(yong),使沟(gou)道(dao)从漏极(ji)(ji)(ji)到源极(ji)(ji)(ji)逐渐(jian)变窄(zhai).当Vds增大到使Vgd=Vgs(TH),沟(gou)道(dao)在漏极(ji)(ji)(ji)左近呈(cheng)现预夹断(duan).
2.导(dao)(dao)(dao)电(dian)(dian)(dian)沟道的(de)(de)(de)构成(Vds=0)当Vds=0时,在栅(zha)源之(zhi)间加(jia)(jia)负(fu)(fu)电(dian)(dian)(dian)压Vgs,由于绝缘层(ceng)(ceng)的(de)(de)(de)存在,故没有电(dian)(dian)(dian)流,但是金(jin)属栅(zha)极(ji)被(bei)补充电(dian)(dian)(dian)而聚(ju)集(ji)负(fu)(fu)电(dian)(dian)(dian)荷,N型(xing)(xing)半导(dao)(dao)(dao)体(ti)中的(de)(de)(de)多(duo)子(zi)(zi)电(dian)(dian)(dian)子(zi)(zi)被(bei)负(fu)(fu)电(dian)(dian)(dian)荷排(pai)斥(chi)向体(ti)内运动,表面留下带(dai)正电(dian)(dian)(dian)的(de)(de)(de)离子(zi)(zi),构成耗(hao)尽(jin)层(ceng)(ceng),随(sui)着(zhe)G、S间负(fu)(fu)电(dian)(dian)(dian)压的(de)(de)(de)增加(jia)(jia),耗(hao)尽(jin)层(ceng)(ceng)加(jia)(jia)宽(kuan),当Vgs增大(da)到一定值时,衬底(di)中的(de)(de)(de)空穴(xue)(少子(zi)(zi))被(bei)栅(zha)极(ji)中的(de)(de)(de)负(fu)(fu)电(dian)(dian)(dian)荷吸收到表面,在耗(hao)尽(jin)层(ceng)(ceng)和(he)绝缘层(ceng)(ceng)之(zhi)间构成一个P型(xing)(xing)薄层(ceng)(ceng),称反型(xing)(xing)层(ceng)(ceng),这(zhei)个反型(xing)(xing)层(ceng)(ceng)就(jiu)构成漏(lou)源之(zhi)间的(de)(de)(de)导(dao)(dao)(dao)电(dian)(dian)(dian)沟道,这(zhei)时的(de)(de)(de)Vgs称为(wei)开启电(dian)(dian)(dian)压Vgs(th),Vgs到Vgs(th)后再(zai)增加(jia)(jia),衬底(di)表面感(gan)应(ying)的(de)(de)(de)空穴(xue)越多(duo),反型(xing)(xing)层(ceng)(ceng)加(jia)(jia)宽(kuan),而耗(hao)尽(jin)层(ceng)(ceng)的(de)(de)(de)宽(kuan)度却不(bu)再(zai)变(bian)化,这(zhei)样(yang)我们可以用Vgs的(de)(de)(de)大(da)小控制导(dao)(dao)(dao)电(dian)(dian)(dian)沟道的(de)(de)(de)宽(kuan)度。
联系方式:邹(zou)先生
联(lian)系电话(hua):0755-83888366-8022
请搜微信公(gong)众号:“KIA半导(dao)体”或扫一扫下图“关(guan)注”官方微信公(gong)众号
请“关(guan)注”官方微信公众号:提供(gong) MOS管 技术帮助